TY - JOUR
T1 - Raw Silk Quality Index Comparison between Electronic Tester and Seriplane Test System
AU - Jianmei Xu, Dongping Wu, Ying Zhou, Suozhuai Dong & Francesco Gatti
JO - Journal of Fiber Bioengineering and Informatics
VL - 3
SP - 339
EP - 348
PY - 2014
DA - 2014/07
SN - 7
DO - http://doi.org/10.3993/jfbi09201404
UR - https://global-sci.org/intro/article_detail/jfbi/4790.html
KW - Electronic Tester for Raw Silk
KW - Seriplane Test
KW - Defects
KW - Yarn Evenness
AB - A new electronic tester consisting of capacitive sensors and optical sensors is now introduced into raw silk
inspection. Compared with the traditional seriplane test, the quality indices change a lot. In assessing
the yarn evenness, the electronic tester measures the coefficient of variation of the raw silk size (CV_{even}%,
CV_{5 m}%, CV_{50 m}%), while the seriplane uses evenness II. In assessing the yarn defects, the electronic
tester measures the slubs, thick places and thin places, SIE (small imperfection element), while the
seriplane test uses cleanness and neatness. However, raw silk users who have been used to the seriplane
test report want to know how to interpret the electronic test indices, they want to be convinced by
knowing the correlation between the indices of the two test systems. In this study 50 lots of raw silk are
sampled and tested by the two test systems, and the correlation coefficients of the corresponding indices
are computed and analyzed. The result shows that there are significant correlation between evenness II
and CV_{5 m}%, a strong correlation between cleanness and slub by the optical sensor, a strong correlation
between neatness and SIE by both the capacitive and the optical sensor, and a strong correlation between
neatness and the thick and thin places by optical sensor. The result confirms the substitution of the
electronic test for seriplane test in future from the technical viewpoint.