@Article{CiCP-16-1389,
author = {Dong Wang, Sihong Shao, Changhao Yan, Wei Cai and Xuan Zeng},
title = {Feature-Scale Simulations of Particulate Slurry Flows in Chemical Mechanical Polishing by Smoothed Particle Hydrodynamics},
journal = {Communications in Computational Physics},
year = {2014},
volume = {16},
number = {5},
pages = {1389--1418},
abstract = {<p style="text-align: justify;">In this paper, the mechanisms of material removal in chemical mechanical
polishing (CMP) processes are investigated in detail by the smoothed particle hydrodynamics (SPH) method. The feature-scale behaviours of slurry flow, rough pad, wafer
defects, moving solid boundaries, slurry-abrasive interactions, and abrasive collisions
are modelled and simulated. Compared with previous work on CMP simulations, our
simulations incorporate more realistic physical aspects of the CMP process, especially
the effect of abrasive concentration in the slurry flows. The preliminary results on
slurry flow in CMP provide microscopic insights on the experimental data of the relation between the removal rate and abrasive concentration and demonstrate that SPH
is a suitable method for the research of CMP processes.</p>},
issn = {1991-7120},
doi = {https://doi.org/10.4208/cicp.261213.030614a},
url = {http://global-sci.org/intro/article_detail/cicp/7084.html}
}